IEC 62899-201 Amd.1 Ed. 1.0 en:2018
Amendment 1 – Printed electronics – Part 201: Materials – Substrates
Amendment by International Electrotechnical Commission, 11/15/2018
IEC
Amendment 1 – Printed electronics – Part 201: Materials – Substrates
Amendment by International Electrotechnical Commission, 11/15/2018
Measurement method of a half-wavelength voltage and a chirp parameter for Mach-Zehnder optical modulator in high-frequency radio on fibre (RoF) systems
standard by International Electrotechnical Commission, 07/27/2017
Power frequency overvoltage protective devices (POPs) for household and similar applications
standard by International Electrotechnical Commission, 08/21/2019
Book by International Electrotechnical Commission, 01/10/2008
Field Device Integration (FDI) – Part 4: FDI Packages
standard by International Electrotechnical Commission, 05/12/2015
Measurement procedures for materials used in photovoltaic modules – Part 1-2: Encapsulants – Measurement of volume resistivity of photovoltaic encapsulants and other polymeric materials
standard by International Electrotechnical Commission, 05/12/2016
Industrial networks – Wireless communication network and communication profiles – ISA 100.11a CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/31/2019
Piezoelectric sensors – Part 2: Chemical and biochemical sensors
standard by International Electrotechnical Commission, 12/13/2017
Piezoelectric sensors – Part 1: Generic specifications
standard by International Electrotechnical Commission, 12/13/2017
Connectors for electronic equipment – Part 02: Detail specification for 8-way, unshielded, free and fixed high density connectors for data transmission up to 250 MHz and with current carrying capacity up to 1 A
standard by International Electrotechnical Commission, 01/20/2017