Category: JEDEC

GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
standard by JEDEC Solid State Technology Association, 05/01/2005

TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
standard by JEDEC Solid State Technology Association, 12/01/1996

SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 07/01/2016

PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS
standard by JEDEC Solid State Technology Association, 08/01/2003

REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES
standard by JEDEC Solid State Technology Association, 12/01/1999

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 08/01/2017

FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2009

SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD
standard by JEDEC Solid State Technology Association, 06/01/2016

Test Trace for 64 GB – 128 GB SSD
Directive by JEDEC Solid State Technology Association, 07/01/2012

GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2002