JEDEC JS 9704
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
standard by JEDEC Solid State Technology Association, 06/01/2005
JEDEC JP001.01
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 05/01/2004
JEDEC JEP120-A
INDEX OF TERMS DEFINED IN JEDEC PUBLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2000
JEDEC JESD 47G.01
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 04/01/2010
JEDEC JESD230B
NAND Flash Interface Interoperability
standard by JEDEC Solid State Technology Association, 07/01/2014
JEDEC JESD214.01
CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 08/01/2017
JEDEC JESD208
SPECIALITY DDR2-1066 SDRAM
standard by JEDEC Solid State Technology Association, 11/01/2007
JEDEC JEP118
GUIDELINES FOR GaAs MMIC AND FET LIFE TESTING
standard by JEDEC Solid State Technology Association, 12/01/2018
JEDEC JESD77D
Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices
standard by JEDEC Solid State Technology Association, 08/01/2012
JEDEC JESD22-B113B
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 08/01/2018