JEDEC JESD22-B113B
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 08/01/2018
JEDEC
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 08/01/2018
Low Power Double Data Rate 4 (LPDDR4)
standard by JEDEC Solid State Technology Association, 2015
UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION
standard by JEDEC Solid State Technology Association, 03/01/2016
STATISTICAL PROCESS CONTROL SYSTEMS
standard by JEDEC Solid State Technology Association, 02/01/2006
PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE
standard by JEDEC Solid State Technology Association, 10/01/2009
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS
standard by JEDEC Solid State Technology Association, 05/01/2002
Low Power Double Data Rate 4 (LPDDR4)
standard by JEDEC Solid State Technology Association, 2014
TRANSIENT VOLTAGE SUPPRESSOR STANDARD FOR THYRISTOR SURGE PROTECTIVE DEVICE
standard by JEDEC Solid State Technology Association, 11/01/1999
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 05/01/2007
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 09/01/2017